Printed Circuit Board Bending Test Jig

Evaluation of Bending Strength of Electronic Components and Printed Circuit Boards

Substrate Guide Bending Test Jig

Bewertung der Biegefestigkeit elektronischer Komponenten

Besonderheiten

  • Kann 3- und 4-Punkt-Tests von Substraten durchführen.

    • Kann Widerstandswerte messen und gleichzeitig die Substratfestigkeit messen. (Optional)
    • Kann kritische Biege- und andere Testparameter berechnen.
    • Die Vorrichtung ist geignet für die durchführung zyklischen Biegetests.
{"title":"Downloads","description":"Laden Sie die neueste Brosch\u00fcre herunter.","source":"product","key":3452,"max":30,"filter_types":["brochures"],"link_title":"Andere Downloads anzeigen","link_url":"","pdf_links":[]} {"title":"Anwendungen","source":"product","key":3452,"max":3,"filter_types":["applications","application_note","posters"],"link_title":"Weitere Informationen","link_url":false,"config_list":[],"page_links":[],"column_title":"Documents"} {"title":"Technische Dokumente","source":"product","key":3452,"max":3,"filter_types":["technical","technical_reports","white_papers","primers"],"link_title":"Weitere Informationen","link_url":"#tbaleAnchor_technical","config_list":[],"page_links":[],"column_title":"Documents"} {"title":"Bedienanleitungen","source":"product","key":3452,"max":3,"filter_types":["manuals"],"link_title":"Weitere Informationen","link_url":"#tbaleAnchor_manual","config_list":[],"page_links":[],"column_title":"Documents"}

Neuigkeiten und Veranstaltungen

Weitere Informationen