Printed Circuit Board Bending Test Jig

Evaluation of Bending Strength of Electronic Components and Printed Circuit Boards

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Substrate Guide Bending Test Jig

Bewertung der Biegefestigkeit elektronischer Komponenten

Besonderheiten

  • Kann 3- und 4-Punkt-Tests von Substraten durchführen.

    • Kann Widerstandswerte messen und gleichzeitig die Substratfestigkeit messen. (Optional)
    • Kann kritische Biege- und andere Testparameter berechnen.
    • Die Vorrichtung ist geignet für die durchführung zyklischen Biegetests.
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